LED Chip Distribution of Thermal Performance
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#21903
In this paper, 65 x 65mm side has nine 1 x 1 mm, 1W LED chip , the other side of the aluminum fin heat sink, using numerical method for solving the three-dimensional steady-state heat conduction differential equations, using computer software to calculate different led chip distribution, the temperature distribution of the chip surface of the heat sink, to analyze distribution of the LED chips affect its heat according to its temperature field. The result: The nine chips together the worst cooling effect, the distance between the chip should reach more than 5mm, the chip temperature can be reduced by more than 5 ℃.
LED lighting , due to the significant energy saving, is considered the next generation of lighting technology. LED is a cold light source, their spectra are not included in the infrared part of the LED is the light efficiency is only 20%, which means that there are more than 80% of the energy is converted into heat. If the heat can not be dissipated effectively, the increase in temperature of the chip, will lead to decline in luminous efficiency, light decay exacerbate serious burnt chip, the LED chip cooling current <span style="font-weight:bold;"><a href="/blog/blog_error.asp?mode=20" target="_blank">LED lighting development in one of the major unsolved problems.
LED chip cooling process is not complicated, just a series of heat conduction process coupled with the convective heat transfer process, temperature range, is a normal temperature heat transfer, heat conduction process in which the use of computer software can solve the three-dimensional equation of heat conduction, calculated analysis of the LED chip and the heat sink, the heat conduction process, and the appearance of convective heat transfer of the heat sink, analyze the main thermal resistance of the entire heat transfer process where you are, what causes it, you can get a very clear solution, so that the people targeted.
LED cooling and similar semiconductor chip cooling, are the lack of basic research and guidance, even if some people do, but not known to everyone. The resulting LED cooling technology today is like the kind of the Warring States period, appear to the heat pipe, and even proposed loop heat pipe. The article only from the different distribution of the <span style="font-weight:bold;">LED chip to study to analyze the impact of the heat dissipation will plays a guiding significance in the design and manufacture of the LED chip.
<span style="font-size:125%;">1. The computer simulation model
<img src="http://img.yaplog.jp/img/18/pc/s/h/a/shareabuzz/0/7.jpg" alt="" border="0" />
As shown in Figure 1, the one side of the aluminum heat sink has a 9 1 x 1mm, 1W of the chip, there are 0.1mm thick thermal coefficient 4W / (m & MID dot; K) of the thermal insulation layer, the fins The total area of ​​m2, air convection heat transfer coefficient = 6 w / (m2 · k), the thermal conductivity of aluminum in the coefficient of 202 W / (m · K). To simplify the calculation, without considering the fin heat conduction problems by the the fin cooling surface simplify translated into 65 x 65mm, the convective heat transfer coefficient of 85 W / (m2 · k) convective heat transfer surface. Solving a side that is the convective heat transfer surface (= 85W / (m2 · k)), and the other side is 9 chips (1 x 1mm, 1w) of the aluminum block (65 x 65 x 3mm) in the spacing of the chips are not simultaneously the internal temperature field.
Solving equations:
<img src="http://img.yaplog.jp/img/18/pc/s/h/a/shareabuzz/0/8.jpg" alt="" border="0" />
Is the three-dimensional steady-state heat conduction differential equation, often referred to as the Laplace equation. Dedicated computing software solution.
<span style="font-weight:bold;">2. The calculated results
Figure 2 is: the different chip spacing, LED chip, in which the metal surface of the heat sink, and over the center of the temperature distribution.
<img src="http://img.yaplog.jp/img/18/pc/s/h/a/shareabuzz/0/9.jpg" alt="" border="0" />
The chip spacing L taken 1mm, 2.5mm, 5mm, 7.5mm, 10mm, 15mm, 20mm, 25mm, 30mm.
When L = 1mm, 9 <span style="font-weight:bold;">LED chips together, no gap between.
Table a different chip spacing, LED chip, the heat sink in which the center point of the metal surface (i.e., the highest temperature point) temperature value and the difference. Ambient temperature in the above calculation to 40 ℃ (313K).
3. Analysis of
From Figure 2 and Table 1 can be clearly seen: When the nine LED chip together (chip spacing L = 1mm), the center point (chip temperature at which the highest point) the highest temperature, that is the worst cooling effect . When the chip spacing increased 1.5mm (L = 2.5mm), the highest point of the temperature dropped to 3.1 ℃, the chip spacing increased 4mm (L = 5mm), the highest point of the temperature drop of 4.8 ° C. When the chip spacing of L = 7.5mm, the highest point of the temperature drop of 5.6 ° C. When chip spacing L = 10mm, the temperature drop of 6.1 ° C. When the chip spacing L = 20 mm, the temperature dropped to 7.2 ℃. The spaced distance L = 10mm internal temperature is reduced significantly.
4. The results
(1) LED chip distribution has a great influence on the heat, the LED chips should be dispersed.
(2) is preferably 1 x 1mm, 1w of the LED chip, the chip spacing take 5 ~ 10mm.
LED lighting , due to the significant energy saving, is considered the next generation of lighting technology. LED is a cold light source, their spectra are not included in the infrared part of the LED is the light efficiency is only 20%, which means that there are more than 80% of the energy is converted into heat. If the heat can not be dissipated effectively, the increase in temperature of the chip, will lead to decline in luminous efficiency, light decay exacerbate serious burnt chip, the LED chip cooling current <span style="font-weight:bold;"><a href="/blog/blog_error.asp?mode=20" target="_blank">LED lighting development in one of the major unsolved problems.
LED chip cooling process is not complicated, just a series of heat conduction process coupled with the convective heat transfer process, temperature range, is a normal temperature heat transfer, heat conduction process in which the use of computer software can solve the three-dimensional equation of heat conduction, calculated analysis of the LED chip and the heat sink, the heat conduction process, and the appearance of convective heat transfer of the heat sink, analyze the main thermal resistance of the entire heat transfer process where you are, what causes it, you can get a very clear solution, so that the people targeted.
LED cooling and similar semiconductor chip cooling, are the lack of basic research and guidance, even if some people do, but not known to everyone. The resulting LED cooling technology today is like the kind of the Warring States period, appear to the heat pipe, and even proposed loop heat pipe. The article only from the different distribution of the <span style="font-weight:bold;">LED chip to study to analyze the impact of the heat dissipation will plays a guiding significance in the design and manufacture of the LED chip.
<span style="font-size:125%;">1. The computer simulation model
<img src="http://img.yaplog.jp/img/18/pc/s/h/a/shareabuzz/0/7.jpg" alt="" border="0" />
As shown in Figure 1, the one side of the aluminum heat sink has a 9 1 x 1mm, 1W of the chip, there are 0.1mm thick thermal coefficient 4W / (m & MID dot; K) of the thermal insulation layer, the fins The total area of ​​m2, air convection heat transfer coefficient = 6 w / (m2 · k), the thermal conductivity of aluminum in the coefficient of 202 W / (m · K). To simplify the calculation, without considering the fin heat conduction problems by the the fin cooling surface simplify translated into 65 x 65mm, the convective heat transfer coefficient of 85 W / (m2 · k) convective heat transfer surface. Solving a side that is the convective heat transfer surface (= 85W / (m2 · k)), and the other side is 9 chips (1 x 1mm, 1w) of the aluminum block (65 x 65 x 3mm) in the spacing of the chips are not simultaneously the internal temperature field.
Solving equations:
<img src="http://img.yaplog.jp/img/18/pc/s/h/a/shareabuzz/0/8.jpg" alt="" border="0" />
Is the three-dimensional steady-state heat conduction differential equation, often referred to as the Laplace equation. Dedicated computing software solution.
<span style="font-weight:bold;">2. The calculated results
Figure 2 is: the different chip spacing, LED chip, in which the metal surface of the heat sink, and over the center of the temperature distribution.
<img src="http://img.yaplog.jp/img/18/pc/s/h/a/shareabuzz/0/9.jpg" alt="" border="0" />
The chip spacing L taken 1mm, 2.5mm, 5mm, 7.5mm, 10mm, 15mm, 20mm, 25mm, 30mm.
When L = 1mm, 9 <span style="font-weight:bold;">LED chips together, no gap between.
Table a different chip spacing, LED chip, the heat sink in which the center point of the metal surface (i.e., the highest temperature point) temperature value and the difference. Ambient temperature in the above calculation to 40 ℃ (313K).
3. Analysis of
From Figure 2 and Table 1 can be clearly seen: When the nine LED chip together (chip spacing L = 1mm), the center point (chip temperature at which the highest point) the highest temperature, that is the worst cooling effect . When the chip spacing increased 1.5mm (L = 2.5mm), the highest point of the temperature dropped to 3.1 ℃, the chip spacing increased 4mm (L = 5mm), the highest point of the temperature drop of 4.8 ° C. When the chip spacing of L = 7.5mm, the highest point of the temperature drop of 5.6 ° C. When chip spacing L = 10mm, the temperature drop of 6.1 ° C. When the chip spacing L = 20 mm, the temperature dropped to 7.2 ℃. The spaced distance L = 10mm internal temperature is reduced significantly.
4. The results
(1) LED chip distribution has a great influence on the heat, the LED chips should be dispersed.
(2) is preferably 1 x 1mm, 1w of the LED chip, the chip spacing take 5 ~ 10mm.
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